MANUFACTURING AND TEST
Manufacturing Facility Our Porirua factory offers the latest manufacturing technologies, including advanced laser-guided surface mount and axial/radial component placement machinery, reflow ovens and wave-soldering equipment. We are able to provide lead-free manufacturing capability. We offer a flexible manufacturing and assembly process, routinely running small and mid-size batches from one to several hundreds. Our facility includes a full mechanical workshop that can provide specific jigs or fixtures to assist this process. Our skilled production staff can manufacture, preform and manually insert a range of components or hardware, including wire assemblies. Full PCB repair service is also available if required. Exicom also specialise in the manufacture of custom-made electrical and RF cables. Exicom's mechanical and process engineering staff support the manufactured items and also the equipment used in the process. Full Bills Of Material and work/assembly instructions can be written for all requirements. Test Facility Our in-house test facility is first-class, with an extensive range of calibrated instrumentation, automated test equipment and climate-control chambers (See footnote below) We have highly skilled staff including test technicians and test engineering personnel to ensure test and diagnosis of electronic circuitry from system to component level. Climate-control Chambers Exicom have three environmental chambers for use in test and servicing of manufactured equipment: - Modified 20-foot shipping container, rated -20°C to +60°C (without humidity control)
- Two heat chambers (approximately size of a domestic fridge) rated -30°C to +70°C with full humidity control
Screened Room for Rx testing Exicom has a fully-screened room that is used to test Receiver modules (typically measuring -120dBm input level) Contract Manufacturing Home Page
|
Surface Mount |
Process - Automated solder paste screen-print with image feedback
- Automated laser guided image feedback Yamaha YVL88 SMD placement
- Automated double-sided glue SMD placement
- Multi-zone Heller 1500 reflow oven
- Soltec dual wave flow solder machine
Components - Rectangular chips 0402 and larger (resistors, capacitors and inductors)
- SOT (Small Outline Transistor) packages
- SOICS (Small Outline Intergrated Circuit) packages
- QFP (Quad Flat Pack) down to 0.5mm pitch
- Supplied in plastic or paper tape, commonly 8mm & 12mm, or grid trays (other tape sizes are possible)
Orientation
|
Automatic Insertion |
Axials - Resistors, diodes, inductors etc
- Lead dia: Up to 0.80mm. Metric & Imperial pitched parts can be inserted.
Radials - Electrolytics, plastic films, disc ceramics, transistors, LED's etc
- Lead dia: Up to 0.60 mm. Metric lead pitches - 2.5, 5.0, 7.5mm (2x2 in-line for Transistors)
- Imperial pitch PCB's possible in some cases.
Orientation Lead Clinch - Clinched inwards or outwards
|
|
|
|
|
|